| 结构参数Construction | ||||||||
| 材料 Material | 标称直径Diameter(mm) | |||||||
| 1.内导体 Inner Conductor | 镀银铜绞线Silver Plated Copper Standed | 7/0.16 | ||||||
| 2.绝缘体 Dielectric | PI薄膜 Polyimide Film | 1.57±0.05 | ||||||
| 3.外导体 Outer Conductor | 镀银铜编织Silver Plated Copper Braid | 2.00 | ||||||
| 4.护套Jacket | PI薄膜 Polyimide Film | 2.29±0.05 | ||||||
| 电性能参数 Electrical Characteristics | ||||||||
| 阻抗 Impedance(Ohm) | 50±3 | |||||||
| 电容 Capacitance(Pf/m) | 105 | |||||||
| 衰减 Attenuation（dB/100m,100MHz) | 26.7 | |||||||
| 额定电压 Voltage Rating(KVDC) | 10 | |||||||
| 额定电流 Current Rating(A) | 3 | |||||||
| 导体电阻Con.Resistance（Ω/km 20℃） | ＜159 | |||||||
| 机械性能参数 Mechanical Characteristics | ||||||||
| 温度范围 Operating Temp.(℃) | -200～+250 | |||||||
| Z小弯曲半径 Minimum Bend Radius（mm) | 14 | |||||||
| RoHS符合性 RoHS Compliant | RoHS | |||||||
